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Overview

 

SMD-PET

 

SMD-PEN

 

SMD-PPS

 

PDF-File

 
WIMA SMD-PEN Page 2
 
Metallized Polyethylene-Naphthalate (PEN) SMD Film Capacitors with Box Encapsulation
 
Special Features

Size codes 1812, 2220 and 2824

with PEN and encapsulated
Operating temperature up to 125°C
Self-healing

According to RoHS 2011/65/EU

Typical Applications
For general DC-applications e.g.
By-pass
Blocking
Coupling and decoupling
Timing
Construction
Dielectric:
Polyethylene-Naphthalate (PEN) film.
Capacitor electrodes:
Vacuum-deposited
Internal construction:
Construction WIMA SMD-PEN

Encapsulation:
Solvent-resistant, flame-retardent plastic case, UL 94 V-0
Terminations:
Tinned plates
Marking:
Colour: Black.

Electrical Data
Capacitance range:
0.01 µF to 1.0 µF
Rated voltages:
63VDC, 100VDC, 250VDC, 400VDC
Capacitance tolerances:
±20%, ±10%, (±5% available subject to special enquiry).
Operating temperature range:
-55°C to +125°C
Climatic test category:
55/125/21 according to IEC
Test voltage:
1.6 Ur, 2 sec
Insulation resistance at +20°C:
Voltage derating:
A voltage derating factor of 1.25% per K must be applied from +100°C for DC voltages and from +90°C for AC voltages.
Reliability:
Operational life > 300000 hours
Failure rate < 2 fit (0.5 x Ur and 40°C)

Processing and application:

Graphs:

Comparison of dielectrics:
Ur Utest C < 0.33 µF 0.33 µF< C < 1.0 µF
63 VDC
100 VDC
50 V
100 V
>3.75 x 103 M
(mean value: 1x104M)
> 1250 sec (Mx µF)
(mean value: 3000 sec)
>250 VDC 100 V >1 x 104 M
(mean value: 5x104M)
> 3000 sec (Mx µF)
(mean value: 10000 sec)
Measuring time: 1 min.
Dissipation factors at +20°C: tan
at f C < 0.1 µF 0.1 µF< C < 1.0 µF
1 kHz
10 kHz
100 kHz
< 8 x10-3
< 15 x10-3
<
30 x10-3
< 8 x10-3
< 15 x10-3
-
Maximum pulse rise time: for pulses equal to the rated voltage.
Capacitance
µF
Pulse rise time V/µsec
max.operation/test
63VDC 100VDC 250VDC 400VDC
0.01 ...0.022
0.033...0.068
0.1...0.22
0.33...0.68
1.0
30/300
20/200
10/100
8/80
3.5/35
35/350
20/200
10/100
6/60
4/40
40/400
40/400
12/120
-
-
35/350
21/210
-
-
-
     
Dip Solder Test/Processing   Packing
Resistance to soldering heat:
Test Tb in accordance with DIN IEC 60068-2-580/DIN EN 60384-19.
Soldering bath temperature max. 260°C.
Soldering duration max. 5sec.
Change in capacitance C/C<5%.
Soldering process:

Re-flow soldering
.
  Available taped and reeled in 12mm blister pack.

Detailed taping information:


Example for ordering / Part number:
 

 

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