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Overview

 

SMD-PET

 

SMD-PEN

 

SMD-PPS

 

PDF-File

 
WIMA SMD-PPS Page 2
 
Metallized Polyphenylene-Sulphide (PPS)
SMD Film Capacitors with Box Encapsulation
 
Special Features

Size codes 1812, 2220, 2824, 4030, 5040 and

6054 with PPS and encapsulated
Operating temperature up to 140°C
Self-healing
Suitable for lead-free soldering
Low dissipation factor
Low dielectric absorption
Very constant capacitance value versus
temperature
According to RoHS 2011/65/EU

Typical Applications
For general applications in high temperature circuits e.g.
By-pass
Blocking
Coupling and decoupling
Timing
Filtering
Oscillating circuits
Construction
Dielectric:
Polyphenylene-sulphide (PPS) film.
Capacitor electrodes:
Vacuum-deposited
Internal construction:
Construction WIMA SMD-PPS
Encapsulation:
Solvent-resistant, flame-retardant plastic case, UL 94 V-0
Terminations:
Tinned plates
Marking:
Colour: Black.
Electrical Data

Capacitance range:
0.01 µF to 2.2 µF
Rated voltages:
63VDC, 100VDC, 250VDC, 400VDC, 630VDC, 1000VDC
Capacitance tolerances:
±20%, ±10% (±5% available subject to special enquiry)
Operating temperature range:
-55°C to +140°C
Climatic test category:
55/140/56 in accordance with IEC
Test voltage:
1.6 Ur, 2 sec
Insulation resistance at +20°C:

Voltage derating:
For DC and AC voltages a voltage derating factor of 1% per K must be applied from +100°C and of 2% per K from +125°C
Reliability:
Operational life > 300000 hours
Failure rate < 2 fit (0.5 x Ur and 40°C)

Processing and application:

Graphs:

Comparison of dielectrics:
Ur Utest C < 0.33 µF 0.33 µF< C < 2.2 µF
63 VDC
100 VDC
50 V
100 V
>1 x 104 M
(mean value: 3x104M)
> 3000 sec (Mx µF)
(mean value: 6000 sec)
>250 VDC 100 V >3 x 104 M
(mean value: 6 x 104M)
> 6000 sec (Mx µF)
(mean value: 12000 sec)
Measuring time: 1 min.
Dissipation factors at +20°C: tan
at f C < 0.1 µF 0.1 µF < C< 1.0 µF C > 1.0 µF
1kHz
10kHz
100kHz
< 15 x 10-4
< 20 x 10-4
<
50 x 10-4

< 20 x 10-4
< 25 x 10-4

-

< 20 x 10-4

-

-

Maximum pulse rise time: for pulses equal to the rated voltage
Capacitance
µF
Pulse rise time V/µsec
max.operation/test
63VDC 100VDC 250VDC 400VDC 630VDC 1000VDC

0.01 ...0.022
0.033...0.068
0.1...0.22

0.33...0.68

1.0...2.2

25/250
15/150
10/100

5/50

3/30

25/250
15/150
10/100

5/50

3/30

30/300
20/200
12/120

6/60

-

35/350

25/250

15/150

8/80

-

40/400

28/280

-

-

-

45/450

32/320

-

-

-

 
Dip Solder Test/ Processing   Packing
Resistance to soldering heat:
Test Td in accordance with DIN IEC 60068-2-58/DIN EN 60384-20.
Soldering bath temperature max. 260°C.
Soldering duration max. 5sec.
Change in capacitance C/C<5%.
Soldering process:

Re-flow soldering.
  Available taped and reeled in 12mm blister pack.

Detailed taping information:

Example for ordering / Part number:
 

 

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